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HY5V26C(L/S)F
4 Banks x 2M x 16bits Synchronous DRAM
DESCRIPTION
Preliminary
The Hynix HY5V26C(L/S)F is a 134,217,728bit CMOS Synchronous DRAM, ideally suited for the main memory applications which require large memory density and high bandwidth. HY5V26C(L/S)F is organized as 4banks of 2,097,152x16 HY5V26C(L/S)F is offering fully synchronous operation referenced to a positive edge of the clock. All inputs and outputs are synchronized with the rising edge of the clock input. The data paths are internally pipelined to achieve very high bandwidth. All input and output voltage levels are compatible with LVTTL. Programmable options include the length of pipeline (Read latency of 2 or 3), the number of consecutive read or write cycles initiated by a single control command (Burst length of 1,2,4,8, or full page), and the burst count sequence(sequential or interleave). A burst of read or write cycles in progress can be terminated by a burst terminate command or can be interrupted and replaced by a new burst read or write command on any cycle. (This pipelined design is not restricted by a 2N rule.)
FEATURES
* * * * Single 3.30.3V power supply All device balls are compatible with LVTTL interface 54Ball FBGA (10.5mm x 8.3mm) All inputs and outputs referenced to positive edge of system clock Data mask function by UDQM or LDQM * * Internal four banks operation Programmable CAS Latency ; 2, 3 Clocks * * * Auto refresh and self refresh 4096 refresh cycles / 64ms Programmable Burst Length and Burst Type - 1, 2, 4, 8 or Full page for Sequential Burst - 1, 2, 4 or 8 for Interleave Burst *
ORDERING INFORMATION
Part No.
HY5V26CF-6 HY5V26CF-K HY5V26CF-H HY5V26CF-8 HY5V26CF-P HY5V26CF-S HY5V26C(L/S)F-6 HY5V26C(L/S)F-K HY5V26C(L/S)F-H HY5V26C(L/S)F-8 HY5V26C(L/S)F-P HY5V26C(L/S)F-S
Clock Frequency
166MHz 133MHz 133MHz
Power
Organization
Interface
Package
Normal 125MHz 100MHz 100MHz 166MHz 133MHz 133MHz Low power 125MHz 100MHz 100MHz 4Banks x 2Mbits x16 LVTTL 54ball FBGA
This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev. 0.9/Jul. 02 1
HY5V26C(L/S)F
BALL CONFIGURATION
9 8 7 3 2 1
A B C D E F G H J < Bottom View >
1 VSS DQ14 DQ12 DQ10 DQ8 UDQM NC A8 VSS 2 DQ15 DQ13 DQ11 DQ9 NC CLK A11 A7 A5 3 VSSQ VDDQ VSSQ VDDQ VSS CKE A9 A6 A4 A B C D E F G H J 7 VDDQ VSSQ VDDQ VSSQ VDD /CAS BA0 A0 A3 8 DQ0 DQ2 DQ4 DQ6 LDQM /RAS BA1 A1 A2 9 VDD DQ1 DQ3 DQ5 DQ7 /WE /CS A10 VDD
54 Ball FBGA 0.8 mm Ball Pitch
< Top View >
Rev. 0.9/Jul. 02 2
HY5V26C(L/S)F
BALL DESCRIPTION
BALL OUT F2 F3 SYMBOL CLK CKE TYPE INPUT INPUT DESCRIPTION Clock : The system clock input. All other inputs are registered to the SDRAM on the rising edge of CLK Clock Enable : Controls internal clock signal and when deactivated, the SDRAM will be one of the states among power down, suspend or self refresh Chip Select : Enables or disables all inputs except CLK, CKE, UDQM and LDQM Bank Address : Selects bank to be activated during RAS activity Selects bank to be read/written during CAS activity Row Address : RA0 ~ RA11, Column Address : CA0 ~ CA8 Auto-precharge flag : A10 Command Inputs : RAS, CAS and WE define the operation Refer function truth table for details Data Mask:Controls output buffers in read mode and masks input data in write mode Data Input/Output:Multiplexed data input/output ball
G9 G7,G8 H7, H8, J8, J7, J3, J2, H3, H2, H1, G3, H9, G2 F8, F7, F9 F1, E8 A8, B9, B8, C9, C8, D9, D8, E9, E1, D2, D1, C2, C1, B2, B1, A2 A9, E7, J9, A1, E3, J1 A7, B3, C7, D3, A3, B7, C3, D7 E2, G1
CS BA0, BA1 A0 ~ A11
INPUT INPUT INPUT
RAS, CAS, WE UDQM, LDQM
INPUT INPUT
DQ0 ~ DQ15 I/O
VDD/VSS
SUPPLY
Power supply for internal circuits Power supply for output buffers No connection
VDDQ/VSSQ SUPPLY NC -
HY5V26C(L/S)F
FUNCTIONAL BLOCK DIAGRAM
2Mbit x 4banks x 16 I/O Synchronous DRAM
Self refresh logic & timer
Internal Row counter
CLK
Row active
2Mx16 Bank 3 Row Pre Decoders 2Mx16 Bank 2 X decoders X decoders 2Mx16 Bank 1 2Mx16 Bank 0 X decoders DQ0 DQ1 I/O Buffer & Logic Sense AMP & I/O Gate
CKE CS State Machine RAS CAS WE UDQM LDQM
X decoders
refresh
Column Active
Memory Cell Array
Column Pre Decoders Y decoders
DQ14 DQ15
Bank Select
Column Add Counter
A0 A1 Address buffers A11 BA0 BA1
Address Registers Burst Counter
Mode Registers
CAS Latency
Data Out Control
Pipe Line Control
Rev. 0.9/Jul. 02
4
HY5V26C(L/S)F
ABSOLUTE MAXIMUM RATINGS
Parameter Ambient Temperature Storage Temperature Voltage on Any ball relative to VSS Voltage on VDD relative to VSS Short Circuit Output Current Power Dissipation Soldering Temperature Time TA TSTG VIN, VOUT VDD, VDDQ IOS PD TSOLDER Symbol 0 ~ 70 -55 ~ 125 -1.0 ~ 4.6 -1.0 ~ 4.6 50 1 260 10 Rating C C V V mA W C Sec Unit
Note : Operation at above absolute maximum rating can adversely affect device reliability.
DC OPERATING CONDITION (TA=0 to 70C)
Parameter Power Supply Voltage Input High voltage Input Low voltage Symbol VDD, VDDQ VIH VIL Min 3.0 2.0 -0.3 Typ 3.3 3.0 0 Max 3.6 VDDQ + 0.3 0.8 Unit V V V Note 1 1,2 1,3
Note : 1.All voltages are referenced to VSS = 0V 2.VIH(max) is acceptable 5.6V AC pulse width with <=3ns of duration. 3.VIL(min) is acceptable -2.0V AC pulse width with <=3ns of duration.
AC OPERATING TEST CONDITION (TA=0 to 70C, VDD=3.30.3V, VSS=0V)
Parameter AC Input High / Low Level Voltage Input Timing Measurement Reference Level Voltage Input Rise / Fall Time Output Timing Measurement Reference Level Voltage Output Load Capacitance for Access Time Measurement Symbol VIH / VIL Vtrip tR / tF Voutref CL Value 2.4/0.4 1.4 1 1.4 50 Unit V V ns V pF 1 Note
Note : 1.Output load to measure access times is equivalent to two TTL gates and one capacitor (50pF). For details, refer to AC/DC output load circuit
Rev. 0.9/Jul. 02
5
HY5V26C(L/S)F
CAPACITANCE (TA=25C, f=1MHz)
-6/K/H Parameter ball Symbol Min Input capacitance CLK A0 ~ A11, BA0, BA1, CKE, CS, RAS, CAS, WE, UDQM, LDQM Data input / output capacitance DQ0 ~ DQ15 CI1 CI2 2.5 2.5 Max 3.5 3.8 Min 2.5 2.5 Max 4.0 5.0 pF pF -8/P/S Unit
CI/O
4.0
6.5
4.0
6.5
pF
OUTPUT LOAD CIRCUIT
Vtt=1.4V
RT=250
Output
Output
50pF
50pF
DC Output Load Circuit
AC Output Load Circuit
DC CHARACTERISTICS I (TA=0 to 70C, VDD=3.30.3V)
Parameter Input Leakage Current Output Leakage Current Output High Voltage Output Low Voltage ILI ILO VOH VOL Symbol Min. -1 -1 2.4 Max 1 1 0.4 Unit uA uA V V Note 1 2 IOH = -2mA IOL = +2mA
Note : 1.VIN = 0 to 3.6V, All other balls are not tested under VIN =0V 2.DOUT is disabled, VOUT=0 to 3.6
Rev. 0.9/Jul. 02
6
HY5V26C(L/S)F
DC CHARACTERISTICS II (TA=0 to 70C, VDD=3.30.3V, VSS=0V)
Speed Parameter Symbol Test Condition -6 Operating Current IDD1 IDD2P IDD2PS Burst length=1, One bank active tRC tRC(min), IOL=0mA CKE VIL(max), tCK = 15ns CKE VIL(max), tCK = CKE VIH(min), CS VIH(min), tCK = 15ns Input signals are changed one time during 30ns. All other balls VDD-0.2V or 0.2V CKE VIH(min), tCK = Input signals are stable. CKE VIL(max), tCK = 15ns CKE VIL(max), tCK = CKE VIH(min), CS VIH(min), tCK = 15ns Input signals are changed one time during 30ns. All other balls VDD-0.2V or 0.2V CKE VIH(min), tCK = Input signals are stable. tCK tCK(min), IOL=0mA All banks active CL=3 CL=2
150 160 240 130 140 220 130
Unit -K
120
Note
-H
120 2
-8
120
-P
110
-S
110 mA 1
Precharge Standby Current in Power Down Mode
mA 1
IDD2N Precharge Standby Current in Non Power Down Mode IDD2NS IDD3P IDD3PS
15 mA 15 5 mA 5
Active Standby Current in Power Down Mode
IDD3N Active Standby Current in Non Power Down Mode IDD3NS
30 mA 20 130 140 220 2 130 140 200 110 120 200 110 mA 120 200 mA mA uA uA 2 3 4 5 1
Burst Mode Operating Current Auto Refresh Current
IDD4 IDD5
tRRC tRRC(min), All banks active
Self Refresh Current
IDD6
CKE 0.2V
800 500
Note : 1.IDD1 and IDD4 depend on output loading and cycle rates. Specified values are measured with the output open 2.Min. of tRRC (Refresh RAS cycle time) is shown at AC CHARACTERISTICS II 3.HY5V26CF-6/K/H/8/P/S 4.HY5V26CLF-6/K/H/8/P/S 5.HY5V26CSF-6/K/H/8/P/S
Rev. 0.9/Jul. 02
7
HY5V26C(L/S)F
AC CHARACTERISTICS I (AC operating conditions unless otherwise noted)
-6 Parameter Symbol Min System Clock Cycle Time CAS Latency = 3 CAS Latency = 2 tCK3 tCK2 tCHW tCLW tAC3 tAC2 tOH tDS tDH tAS tAH tCKS tCKH tCS tCH tOLZ tOHZ3 tOHZ2 6 1000 10 2.5 2.5 2.7 1.5 0.8 1.5 0.8 1.5 0.8 1.5 0.8 1 2.7 2.7 5.4 6 5.4 5.4 7.5 2.5 2.5 2.7 1.5 0.8 1.5 0.8 1.5 0.8 1.5 0.8 1 2.7 2.7 5.4 5.4 5.4 5.4 Max Min 7.5 1000 10 2.5 2.5 2.7 1.5 0.8 1.5 0.8 1.5 0.8 1.5 0.8 1 2.7 3 5.4 6 5.4 6 Max Min 7.5 1000 10 3 3 3 2 1 2 1 2 1 2 1 1 3 3 6 6 6 6 Max Min 8 1000 10 3 3 3 2 1 2 1 2 1 2 1 1 3 3 6 6 6 6 Max Min 10 1000 12 3 3 3 2 1 2 1 2 1 2 1 1 3 3 6 6 6 6 Max Min 10 1000 ns ns ns ns 2 CAS Latency = 2 ns ns ns ns ns ns ns ns ns ns ns ns ns 1 1 1 1 1 1 1 1 1 1 Max ns -K -H -8 -P -S Unit Note
Clock High Pulse Width Clock Low Pulse Width Access Time From Clock Data-Out Hold Time Data-Input Setup Time Data-Input Hold Time Address Setup Time Address Hold Time CKE Setup Time CKE Hold Time Command Setup Time Command Hold Time CLK to Data Output in Low-Z Time CLK to Data Output in High-Z Time CAS Latency = 3 CAS Latency = 2 CAS Latency = 3
Note : 1.Assume tR / tF (input rise and fall time ) is 1ns If tR & tF > 1ns, then [(tR+tF)/2-1]ns should be added to the parameter 2.Access times to be measured with input signals of 1v/ns edge rate, from 0.8v to 2.0v If tR > 1ns, then (tR/2-0.5)ns should be added to the parameter
Rev. 0.9/Jul. 02
8
HY5V26C(L/S)F
AC CHARACTERISTICS II
-6 Parameter Symbol Min Operation RAS Cycle Time Auto Refresh RAS to CAS Delay RAS Active Time RAS Precharge Time RAS to RAS Bank Active Delay CAS to CAS Delay Write Command to Data-In Delay Data-In to Precharge Command Data-In to Active Command DQM to Data-Out Hi-Z DQM to Data-In Mask MRS to New Command Precharge to Data Output Hi-Z CAS Latency = 3 CAS Latency = 2 tRRC tRCD tRAS tRP tRRD tCCD tWTL tDPL tDAL tDQZ tDQM tMRD tPROZ3 tPROZ2 tPDE tSRE tREF 60 18 42 18 12 1 0 2 5 2 0 2 3 2 1 1 100K 64 65 15 45 15 15 1 0 2 4 2 0 2 3 2 1 1 100K 64 65 20 45 20 15 1 0 2 5 2 0 2 3 2 1 1 100K 64 68 20 48 20 16 1 0 1 4 2 0 2 3 2 1 1 100K 64 70 20 50 20 20 1 0 1 3 2 0 2 3 2 1 1 100K 64 70 20 50 20 20 1 0 1 3 2 0 2 3 2 1 1 100K 64 ns ns ns ns ns CLK CLK CLK CLK CLK CLK CLK CLK CLK CLK CLK ms 1 tRC 60 Max Min 60 Max Min 65 Max Min 68 Max Min 70 Max Min 70 Max ns -K -H -8 -P -S Unit Note
Power Down Exit Time Self Refresh Exit Time Refresh Time
Note : 1. A new command can be given tRRC after self refresh exit
Rev. 0.9/Jul. 02
9
HY5V26C(L/S)F
IBIS SPECIFICATION
IOH Characteristics (Pull-up)
Voltage (V) 3.45 3.3 3.0 2.6 2.4 2.0 1.8 1.65 1.5 1.4 1.0 0 0 -21.1 -34.1 -58.7 -67.3 -73 -77.9 -80.8 -88.6 -93 100MHz (Min) I(mA) 100MHz (Max) I(mA) -2.4 -27.3 -74.1 -129.2 -153.3 -197 -226.2 -248 -269.7 -284.3 -344.5 -502.4 -0.7 -7.5 -13.3 -27.5 -35.5 -41.1 -47.9 -52.4 -72.5 -93 66MHz (Min) I(mA)
66MHz and 100MHz Pull-up
0 0 -100 -200 I (mA) -300 -400 -500 -600 Voltage (V)
IOH Min (100MHz) IOH Min (66MHz) IOH Max (66 /100MHz)
0.5
1
1.5
2
2.5
3
3.5
IOL Characteristics (Pull-down)
Voltage (V) 0 0.4 0.65 0.85 1.0 1.4 1.5 1.65 1.8 1.95 3.0 3.45 100MHz (Min) I(mA) 0 27.5 41.8 51.6 58.0 70.7 72.9 75.4 77.0 77.6 80.3 81.4 100MHz (Max) I(mA) 0 70.2 107.5 133.8 151.2 187.7 194.4 202.5 208.6 212.0 219.6 222.6 66MHz (Min) I(mA) 0 17.7
66MHz and 100MHz Pull-down
250 200 150 100 50 0 0 0.5 1 1.5 2 2.5 3 3.5
33.3 37.6 46.6 48.0 49.5 50.7 51.5 54.2 54.9
I (mA)
26.9
Voltage (V)
IOL Min (100MHz) IOL Min (66MHz) IOL Max (100MHz)
Rev. 0.9/Jul. 02
10
HY5V26C(L/S)F
VDD Clamp @ CLK, CKE, CS, DQM & DQ
VDD (V) 0.0 0.2 0.4 0.6 0.7 0.8 0.9 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 I(mA) 0.0 0.0 0.0 0.0
Minimum VDD clamp current (Referenced to VDD)
20 15 mA 10 5 0 0 1 Voltage I (mA) 2 3
0.0 0.0 0.0 0.23 1.34 3.02 5.06 7.35 9.83 12.48 15.30 18.31
VSS Clamp @ CLK, CKE, CS, DQM & DQ
VSS (V) -2.6 -2.4 -2.2 -2.0 -1.8 -1.6 -1.4 -1.2 -1.0 -0.9 -0.8 -0.7 -0.6 -0.4 -0.2 0.0 I (mA) -57.23 -45.77 -38.26 -31.22 -24.58 -18.37 -12.56 -7.57 -3.37 -1.75 -0.58 -0.05 0.0 0.0 0.0 0.0
Minimum VSS clamp current
-3 0 -10 -20 -2.5 -2 -1.5 -1 -0.5 0
mA
-30 -40 -50 -60
Voltage I (mA)
Rev. 0.9/Jul. 02
11
HY5V26C(L/S)F
DEVICE OPERATING OPTION TABLE
HY5V26C(L/S)F-6
CAS Latency 166MHz(6ns) 143MHz(7ns) 133MHz(7.5ns) 3CLKs 3CLKs 2CLKs tRCD 3CLKs 3CLKs 3CLKs tRAS 7CLKs 6CLKs 6CLKs tRC 10CLKs 9CLKs 9CLKs tRP 3CLKs 3CLKs 3CLKs tAC 5.4ns 5.4ns 5.4ns tOH 2.7ns 2.7ns 2.7ns
HY5V26C(L/S)F-K
CAS Latency 133MHz(7.5ns) 125MHz(8ns) 100MHz(10ns) 2CLKs 3CLKs 2CLKs tRCD 2CLKs 3CLKs 2CLKs tRAS 6CLKs 6CLKs 5CLKs tRC 8CLKs 9CLKs 7CLKs tRP 2CLKs 3CLKs 2CLKs tAC 5.4ns 6ns 6ns tOH 2.7ns 3ns 3ns
HY5V26C(L/S)F-H
CAS Latency 133MHz(7.5ns) 125MHz(8ns) 100MHz(10ns) 3CLKs 3CLKs 2CLKs tRCD 3CLKs 3CLKs 2CLKs tRAS 6CLKs 6CLKs 5CLKs tRC 9CLKs 9CLKs 7CLKs tRP 3CLKs 3CLKs 2CLKs tAC 5.4ns 6ns 6ns tOH 2.7ns 3ns 3ns
HY5V26C(L/S)F-8
CAS Latency 125MHz(8ns) 100MHz(10ns) 83MHz(12ns) 3CLKs 2CLKs 2CLKs tRCD 3CLKs 2CLKs 2CLKs tRAS 6CLKs 5CLKs 4CLKs tRC 9CLKs 7CLKs 6CLKs tRP 3CLKs 2CLKs 2CLKs tAC 6ns 6ns 6ns tOH 3ns 3ns 3ns
HY5V26C(L/S)F-P
CAS Latency 100MHz(10ns) 83MHz(12ns) 66MHz(15ns) 2CLKs 2CLKs 2CLKs tRCD 2CLKs 2CLKs 2CLKs tRAS 5CLKs 5CLKs 4CLKs tRC 7CLKs 7CLKs 6CLKs tRP 2CLKs 2CLKs 2CLKs tAC 6ns 6ns 6ns tOH 3ns 3ns 3ns
HY5V26C(L/S)F-S
CAS Latency 100MHz(10ns) 83MHz(12ns) 66MHz(15ns) 3CLKs 2CLKs 2CLKs tRCD 2CLKs 2CLKs 2CLKs tRAS 5CLKs 5CLKs 4CLKs tRC 7CLKs 7CLKs 6CLKs tRP 2CLKs 2CLKs 2CLKs tAC 6ns 6ns 6ns tOH 3ns 3ns 3ns
Rev. 0.9/Jul. 02
12
HY5V26C(L/S)F
COMMAND TRUTH TABLE
Command Mode Register Set No Operation Bank Active Read H Read with Autoprecharge Write H Write with Autoprecharge Precharge All Banks H Precharge selected Bank Burst Stop DQM Auto Refresh Burst-Read-Single-WRITE Entry Self Refresh1 Exit L H L H Entry Precharge power down Exit L H L H Clock Suspend Entry Exit H L L L H V X V V X H X H X H X X X H L L H H X H X H X X X H X H X H X X H H H H H H X L L L L H X L H X L L L X L L L X H H H X X H L X V X X X X X L L H L X X L X X X A9 ball High (Other balls OP code) V X L H L L X CA H H X X L H L H X CA H L V CKEn-1 H H H CKEn X X L X L H L H H H H X RA L V V CS L H RAS L X CAS L X WE L X X X DQM X
ADDR
A10/ AP OP code
BA
Note
Note : 1. Exiting Self Refresh occurs by asynchronously bringing CKE from low to high 2. X = Dont care, H = Logic High, L = Logic Low. BA =Bank Address, RA = Row Address, CA = Column Address, Opcode = Operand Code, NOP = No Operation
Rev. 0.9/Jul. 02
13
HY5V26C(L/S)F
PACKAGE INFORMATION 54 Ball 0.8mm pitch 8.3mm x 10.5mm FBGA
Rev. 0.9/Jul. 02
14

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